By: Carl Black Subject: Notes from Dragon Packaging Meetings File: /Ivy/Black/General/PackageNotes.Tioga Last Updated: February 26, 1985 4:45:36 pm PST The packaging issues that need to be addressed are: I) Chip Packaging: A) What is the PGA socket size (LIF Vs ZIF)? Will a LIF cause a routing problem? B) Can we use PGAs with > 144 pins? II) Mechanical Package: A) How many M-bus & VME-bus card slots? 1) Standard Dragon 2) Extended Dragon B) How are M & VME buses connected? 1) Standard Dragon 2) Extended Dragon C) What is the board spacing? (1"?) D) What are the overall dimensions? 1) Standard Dragon 2) Extended Dragon III) Prototype : A) Stitch-weld Vs Wire-wrap B) Will the prototype be a Extended system exactly? IV) Electrical: A) Where are voltages other than 5 V required and how are they generated? V) Partitioning: Where does the Arbiter go? VI) Power consumption A) How much power can an office handle? (Black to ask Lee Anderson) 1) Electrical power 2) Cooling B) How noisy will a Standard Dragon be? Build a mock up? (Overton) VII) Misc: A) Slot independence and slot IDs B) Number of I/O Bus pins. Conclusions of the 18-Feb-85 Dragon Meeting: 1) We will build one set of boards that can plug into either of two packages: a) Standard system package b) Extended (maximally configurable) system package (2x the width of the Standard package.) 2) So that it may be put into an office, the Standard system will be designed such that it will consume at most 600 watts of line (AC) power. Moreover, it's mechanical design will made as quiet as possible. 3) Due to its excessive power consumption and noise, the Extended system must be installed in a machine room. The Standard system may be installed in either an office or a machine room. Remote installation makes necessary the design for remote video transmission. 4) The Extended system package will be twice the width of the Standard package. 5) The Extended system package will also be used for prototype debug because it is electrically more difficult. 6) The Standard and the Extended system packages will each require their own unique set of power supplier and fans, but will use the same types of connectors. Conclusions of the 20-Feb-85 Dragon Packaging Meeting: 1) We will use ED's board size (10.9" x 16"), format, and connector. 2) The processor board will be designed to hold 20 PGAs, D-bus logic, & perhaps clock distribution drivers. 4 Cache/Proc. 1 IFU/Proc. 1 EU/Proc. 2 Fl Pt/Proc. -------------------- 8 Chips/Proc * 2 Proc. + 4 spare for extra cache chips = 20 3) The Memory board will be designed assuming 1 Mbit RAMs, upgradable to 4 Mbit RAMs. a) Because of the greater density, the Dragon system need not be designed for more than 2 memory boards. b) The memory board will have either 144 RAM DIPs or 288 RAM SIPs, to be decided by the memory board designer. c) Capacity of each board would be: 1. 16 MBytes with 1-Mbit DIPs, 2. 32 MBytes with 1-Mbit SIPs, 3. 64 MBytes with 4-Mbit DIPs, or 4. 128 MBytes with 4-Mbit SIPs. 4) The System Controller board plugs into an M-bus slot and holds: a) Map Processor, b) M-VME Bus Coupler, & c) System clock generation and distribution. Conclusions of the 29-Jan-85 & 6-Feb-85 Dragon Packaging Meetings: We considered the cost of two configuration bounds: A minimally configured system and a maximally configured system. The following table summarizes the power and cost for each configuration. Minimally Config Sys Maximally Config Sys ! Item ! Definition !Power! Cost ! Definition! Power! Cost ! ! ! ! ! ! Memory ! 1 4MB Brd ! 20W!$1100 ! 8 4MB Brds! 90W !$8800 Board ! ! ! ! ! ! ! ! ! ! ! ! Proc Brd! 1, 2-Proc. ! 30 ! 1500 ! 5, 2-Proc.! 150 ! 7500 ! Brd ! ! ! Brds ! ! ! ! ! ! ! ! Display ! 1 Board ! 80 ! 2300 ! 4 Boards ! 320 ! 9200 Proc. ! ! ! ! ! ! ! ! ! ! ! ! System ! 1 Board ! 50 ! 500 ! Same ! 50 ! 500 Cntlr ! ! ! ! ! ! Board ! ! ! ! ! ! ! ! ! ! ! ! VME ! 5 Boards ! 100 !15000 ! 9 Boards ! 170 !20000 Subsys ! ! ! ! ! ! ! ! ! ! ! ! VDT ! 1 B&W High ! 150 ! 1000 ! Same+24b ! 345 ! 4000 ! Resolution! ! ! Color ! ! ! ! ! ! ! ! ! ! ! ! ! ! Disk ! 1, 5-1/4" ! 25 ! 600 ! 2, 5-1/4" ! 50 ! 1200 ! Winchester! ! ! Winchstr ! ! ! ! ! ! ! ! Fans, ! 20 MBus & ! 5 ! 2000 ! Same ! 5 ! 2000 Pkg, ! 9 VMEBus ! ! ! ! ! BkPlns ! slots ! ! ! ! ! ! ! ! ! ! ! Power ! 900W !{75%}! 1000 ! Same ! {75%}! 1000 Supply ! Delivered ! ! ! ! ! ========!============!=====!======!===========!======!===== Dragon ! Min Config ! 600 !25000 ! Max Config! 1560 !54200 System ! System ! ! ! System ! ! Considering the above data, the attendees at the 29-Jan-85 packaging meeting came to the following conclusions: 1) Since we are only willing to design one package, the package will be designed for a maximally configured system. 2) The package will support 20 M-Bus boards, 9 VME-Bus boards, and 2 5-1/4" Winchester disk drives. 3) The package will be built around a 19" rack. 4) Due to the size, noise, and power consumption of a maximally configured system, it will have to be designed for a remote machine room. (A minimally configured system in the office, however, might still be viable. Also, Deutsch suggested that multiple minimally configured systems might be put in one Dragon package.) 5) Due to the cost of vendor VME cards, Gasbarro suggested that we build our own. 6) There is an interest in building a smaller Dragon (call it Dragon-II). Dragon-II would have less expansibility and computational power than Dragon-I. It would use most of the same chips as Dragon-I, but have new board and package designs. A desk-top version was suggested by Barth and a Dove-like (wireless) package was suggested by Overton. Supporting Calculations: Note: All cost calculations assume custom CMOS ICs from ICL are free. Memory Board: Active Board Power Inactive Board Power 4W = 2 Cntl Chips * 2W 4W = 2 Cntl Chips * 2W 12.6 = 36 ActiveChps * 0.35W 0 = 0 ActiveChps * 0.35W 3.8 = 108 InactChps * 0.035W 5 = 144 InactChps * .035W ---- --- 20.4W 9W Cost Per Board $300 Board 720 RAM chips 20 Misc 60 2, PGA sockets & chip carriers ------ $1100 Processor Board (2 Processors): Processor Board Power 6W = 2 Floating Point chip sets * 3W each 16 = 8 Cache chips * 2W 4 = 2 IFU chips * 2W 4 = 2 EU chips * 2W ---- 30W Cost Per Board $300 Board 700 Floating Point chips 480 16, PGA sockets & chip carriers 20 Misc ------ $1500 Display Processor Board: Board Power 10W = 5 CMOS Chips * 2W 32.0 = 64 ActiveChps * 0.5W 3.2 = 64 InactChps * 0.05W 10 = Color maps 10 = Video shift Regs. ---- 65.2W Cost Per Board $300 Board 1700 RAM chips 100 Color map, DAC 150 5, PGA sockets & chip carriers 50 Misc ------ $2300 System Controller Board: Board Power 4W = 2 Map Chips * 2W 12 = Clock generation and distribution 2 = Cache for M-Bus/VME-Bus interface 20 = Vendor chips for M-Bus/VME-Bus interface 10 = Diagnostic Bus 2 = Arbiter ---- 50W Cost Per Board $300 Board 150 5, PGA sockets & chip carriers 50 Misc ------ $500 VME Subsystem: Subsystem Power 15W = 68020 Board 15 = Winchester disk controller board 30 = Ethernet controller board 10 = 1MByte memory board 20 = Keyboard & mouse interface board ---- 90W = Total for minimally configured system 80 = 4 Misc. boards (eg, audio, speech, tape) ---- 170W Total for maximally configured system Cost Per Subsystem (assuming vendor boards) $15000 Total for minimally configured system 20000 Total for maximally configured system VDTs: VDT Power 150W = High Res. black & white 250W = High Res. 24-bit color Cost Per VDT $1000 High Res. black & white $3000 High Res. 24-bit color Disk Drives: Drive Power 25W = 1, 5-1/4" Winchester drive >100 MByte Cost Per Drive $600 Mechanical Package & Fans: Fans Power 5W = Cost Per Package $2000 Power Supply: Power Efficiency 75% Power Supply Cost $1000 900 W delivered