BackPanel 1.0
- Board size :13.5" by 17.5"
- 12 layers multilayer board.
- Layers 1 (top), 2, 3, 4, 5, 8, 9, 10, 11, 12 (bottom) are 1/2 once copper.
- Layers 6 and 7 are 2 onces copper.
- Controled inpedance lines (50 ohm) in layers 3 5 8 and 10.
- FR4 laminate 10 mills +/- 20%.
- PrePreg thickness 10 mills +/- 20%.
- PrePreg dielectric constant 4.8
- Total board thickness will be around 120 mills.
- Minimum geometry:
6 mills traces on 1/2 once copper. (The films are shooted at 7 mills in the inner layers)
6 mills spaces.
Smallest hole diameter 25 mills finished.
- Layer 1 (top) is entirely gold plated (100u" Ni, 10u" Au).
- Dry film soldermask on top and on bottom (the 2 soldermasks are different).
- Silkscreen on top and on bottom (the 2 silkscreens are different).
- 7 holes diameters. All holes plated trough. Tolerance +/- 3 mills finished size. Total 4594 holes.
25 mills finished size. 2969 holes.
37 mills finished size. 1452 holes.
113 mills finished size. 98 holes.
128 mills finished size. 14 holes.
144 mills finished size. 14 holes.
157 mills finished size. 40 holes.
261 mills finished size. 7 holes.
- Others documents:
1 mechanical drawing.
2 silkscreen films.
2 soldermask films (the film called padmaster is in fact the bottom soldermask)
12 layer films.
1 drill tape and info to read it.