BackLink.wirewrap.dublin.tioga
Copyright Ó 1988 by Xerox Corporation. All rights reserved.
Christophe Cuenod June 6, 1988 3:06:23 pm PDT
BackLink.wirewrap
- Board size :13.5" by 12.5"
- 7 layers multilayer board (4 signal layers and 3 power planes).
- Signal layers are in 1/2 once copper.
- Power planes are in 1 once copper.
- FR4 laminate
- Board thickness will be 105 mils + 0 - 10 mils .
- Minimum geometry:
6 mils traces .
6 mils spaces.
Smallest hole diameter 16 mils finished (21 mils drilled).
Minimum annular ring in trace layers 5 mils over drilling size (31 mils pads for 21 mils drilled).
Minimum annular ring in power layers 11 mils over drilling size (43 mils pads for 21 mils drilled).
Maximum holes aspect ratio 5 (105/21).
- Photoimagable soldermask on top and on bottom.
- Silkscreen on top.
- The board is completely gold plated on both sides (100u Ni, 100u Au)
- Plated trough holes.
5 different diameters.
16 mils finished size. 424 holes. Tolerance not important
35 mils finished size. 621 holes. Tolerance +/- 3 mils.
40 mils finished size. 2392 holes. Tolerance +/- 3 mils.
55 mils finished size. 776 holes. Tolerance +/- .5 mils.
67 mils finished size. 2100 holes. Tolerance +/- .5 mils.
- Non plated trough holes.
1 diameter.
144 mils finished size. 2 holes. Tolerance +/- 3 mils.
- Board Routing.
The dimensions around the connectors are mesured with respect to the copper targets.
- Others documents:
1 mechanical drawing.
1 silkscreen film.
1 soldermask film.
7 layer films.
1 drill tape and info to read it.