<> <> CDMEBES _ %CDMEBES.stripesPerClump _ 5 -- package default is 10 _ %CDProperties.PutPropOnTechnology[onto: %CMos.cmos, prop: $CDMEBESNmPerLambda, val: NEW[INT _ 1000]] _ %CDProperties.PutPropOnTechnology[onto: %CMos.cmos, prop: $CDMEBESNmPerEBESPixel, val: NEW[INT _ 500]] <<.. the die size>> _ %CDProperties.PutPropOnTechnology[onto: %CMos.cmos, prop: $CDMEBESXNmPerDie, val: NEW[INT _ 8130000]] _ %CDProperties.PutPropOnTechnology[onto: %CMos.cmos, prop: $CDMEBESYNmPerDie, val: NEW[INT _ 9145000]] _ &s _ 10000 -- nm, see VTI design rules, document 02-ECL-2, figure 7.2, page 26/52 _ %CDProperties.PutPropOnTechnology[onto: %CMos.cmos, prop: $CDMEBESActiveToScribeCenter, val: NEW[INT _ &s+14000+45000 -- active area 25 um inside metal 2 scribe ring --]] _ %CDProperties.PutPropOnTechnology[onto: %CMos.cmos, prop: $CDMEBESNmMaxBloat, val: NEW[INT _ 10000]] <<.. CMOS masks:>> <<.. To allow test structures located in the scribe lines, these chips have VTI scribe structures that are as small as possible. The MEBES job deck will step in the test structure "dice".>> << thin oxide or diffusion = 10>> <<>> _ &thinOxScribe _ NEW[%CDMEBES.ScribeRec _ [scribeCenterToOuterEdge: 0, width: &s+14000 -- nm --]] <<>> _ &thinOx _ NEW[%CDMEBES.MaskSpecRec _ [name: "10", cover: LIST[$OR, NEW[%CDMEBES.CDLayerRec _ [source: %CMos.ndif, deltaDiameter: 1000 -- nm --]], NEW[%CDMEBES.CDLayerRec _ [source: %CMos.pdif, deltaDiameter: 1000 -- nm --]], NEW[%CDMEBES.CDLayerRec _ [source: %CMos.pwellCont, deltaDiameter: 1000 -- nm --]], NEW[%CDMEBES.CDLayerRec _ [source: %CMos.nwellCont, deltaDiameter: 1000 -- nm --]], &thinOxScribe]]] <<>> <> <<>> _ &pWell _ NEW[%CDMEBES.MaskSpecRec _ [name: "11", cover: NEW[%CDMEBES.CDLayerRec _ [source: %CMos.nwell, deltaDiameter: -2000 -- nm --]]]] <<>> <> <<>> _ &ndifs _ LIST[$OR, NEW[%CDMEBES.CDLayerRec _ [source: %CMos.ndif]], NEW[%CDMEBES.CDLayerRec _ [source: %CMos.nwellCont]]] _ &pdifs _ LIST[$OR, NEW[%CDMEBES.CDLayerRec _ [source: %CMos.pdif]], NEW[%CDMEBES.CDLayerRec _ [source: %CMos.pwellCont]]] _ &nImp _ NEW[%CDMEBES.MaskSpecRec _ [name: "24", cover: LIST[$OR, LIST[$RestrictNImplant, NEW[INT _ 1500 -- maxRadialExtension, nm -- ], &ndifs, &pdifs], NEW[%CDMEBES.ScribeRec _ [scribeCenterToOuterEdge: &s+2000 -- nm --, width: 12000 -- nm --]]]]] <> <<>> _ &pImp _ NEW[%CDMEBES.MaskSpecRec _ [name: "25", cover: LIST[$OR, LIST[$RestrictNImplant, NEW[INT _ 1500 -- maxRadialExtension, nm -- ], &pdifs, &ndifs], &thinOxScribe]]] <> <<>> _ &nWellScribe _ NEW[%CDMEBES.ScribeRec _ [scribeCenterToOuterEdge: 0, width: &s+2000 -- nm --]] _ &nWell _ NEW[%CDMEBES.MaskSpecRec _ [name: "26", cover: LIST[$OR, NEW[%CDMEBES.CDLayerRec _ [source: %CMos.nwell, deltaDiameter: -8000 -- nm --]], &nWellScribe]]] <<>> <> <<>> _ &poly _ NEW[%CDMEBES.MaskSpecRec _ [name: "40", cover: LIST[$OR, NEW[%CDMEBES.CDLayerRec _ [source: %CMos.pol, deltaDiameter: 0 -- nm --]], NEW[%CDMEBES.ScribeRec _ [scribeCenterToOuterEdge: &s+10000 -- nm --, width: 8000 -- nm --]]]]] <> <<>> _ &cut _ NEW[%CDMEBES.MaskSpecRec _ [name: "50", cover: LIST[$OR, NEW[%CDMEBES.CDLayerRec _ [source: %CMos.cut, deltaDiameter: 0 -- nm --]], NEW[%CDMEBES.ScribeRec _ [scribeCenterToOuterEdge: 0, width: &s+16000 -- nm --]]]]] <> <<>> _ &cut2 _ NEW[%CDMEBES.MaskSpecRec _ [name: "51", cover: LIST[$OR, NEW[%CDMEBES.CDLayerRec _ [source: %CMos.cut2, deltaDiameter: 0 -- nm --]], &vtiNWellScribe]]] <> <<>> _ &metal _ NEW[%CDMEBES.MaskSpecRec _ [name: "60", cover: LIST[$OR, NEW[%CDMEBES.CDLayerRec _ [source: %CMos.met, deltaDiameter: 0 -- nm --]], NEW[%CDMEBES.ScribeRec _ [scribeCenterToOuterEdge: &s+6000 -- nm --, width: 14000 -- nm --]]]]] <> <<>> _ &metal2 _ NEW[%CDMEBES.MaskSpecRec _ [name: "61", cover: NEW[%CDMEBES.CDLayerRec _ [source: %CMos.met2, deltaDiameter: 0 -- nm --]]]]] <> <<>> _ &glass _ NEW[%CDMEBES.MaskSpecRec _ [name: "70", cover: LIST[$OR, NEW[%CDMEBES.CDLayerRec _ [source: %CMos.ovg, deltaDiameter: 0 -- nm --]], NEW[%CDMEBES.ScribeRec _ [dieEdgeToLineCenter: 0, lineWidth: &s -- nm --]]]]] <> <<>> _ &nitride _ NEW[%CDMEBES.MaskSpecRec _ [name: "71", cover: LIST[$OR, NEW[%CDMEBES.CDLayerRec _ [source: %CMos.ovg, deltaDiameter: 0 -- nm --]], NEW[%CDMEBES.ScribeRec _ [dieEdgeToLineCenter: 0, lineWidth: &s-10000 -- nm --]]]]] <<>> _ %CDProperties.PutPropOnTechnology[onto: %CMos.cmos, prop: $CDMEBESMaskSetSpec, val: LIST[&thinOx, &nWell, &pWell, &nImp, &pImp, &vtiNWell, &vtiPWell, &poly, &cut, &metal, &glass, &cut2, &metal2, &nitride]] <<>> <<.. the name of the die (until I figure out how to get it into the design)>> _ %CDProperties.PutPropOnAtom[$MEBESMask, $CDMEBESMaskSetName, "MPCxxZZ"]