Steve,
Here are the description of the skills and responsibilities of a micropackaging person for SUN/Dragon.
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Determine the physical, thermal and electrical specifications for a high performance multiprocessor computer system. This will include responsibilities for packaging design details for the cooling, back-panel, daughter boards and special high pin count ASIC packages.
Choose a suitable VLSI packaging design (PGA, SMD or multi-chip module) to minimize ground bounce, crosstalk, propagation velocity, bus loading and cope with high expected power dissipation.
Be familiar with electrical properties of multiple conductor terminated transmission line Bus.
Evaluate and select reliable high pin count board connectors.
Evaluate vendor capability in fine-line, multi-layer PCB technology including high pin count SMD packages. Be comfortable with the selection and use of CAD tools.
Participate in the development or selection of a multi chip module packaging method.
Be familiar with EMI requirements and low EMI design methods.
Coordinate with manufacturing people at all stages of the system design to assure a smooth transition from prototype to low-cost, high-volume production.
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Here are the requirements for a SunDragon diagnostic person.
The job position consists in writing diagnostic software for a new high-performance multiprocessor server permitting a high degree of hardware availability.
The first stage of those diagnostics is to help debug a prototype hardware design and verify that the hardware provides adequate support for production diagnostics.
The second stage consists in writing service processor code for fault detection, fault isolation and system (re)configuration at bootstrap time. The job will require fluency in C and adequate knowledge of SPARC assembly language. Previous experience in diagnostic code and/or low-level machine support code is highly desirable. Previous experience in multiprocessors is not required.