Generate:
PROC = {
rules: Rules ← NewRules[$Hybrid, CMosB.cmosB, 1, 1];
Drawn Layers
pDif: Layer ← NewLayer[rules, $PDif, "CPD", "P+ well diffusion", "Defines P+ diffused areas when diffusion does not contact substrate or well", CMosB.pdif];
nDif: Layer ← NewLayer[rules, $NDif, "CND", "N+ diffusion", "Defines N+ diffused areas when diffusion does not contact substrate or well", CMosB.ndif];
poly: Layer ← NewLayer[rules, $Poly, "CP", "Polysilicon", "Defines poly gates and poly interconnect", CMosB.pol];
contact: Layer ← NewLayer[rules, $Contact, "CC", "Contact", "Defines contact openings to diffusion and poly", CMosB.cut];
metal1: Layer ← NewLayer[rules, $Metal1, "CM", "Metal 1", "Defines first metal interconnects", CMosB.met];
via: Layer ← NewLayer[rules, $Via, "CC2", "Via", "Defines openings in the insulator between first and second metal", CMosB.cut2];
metal2: Layer ← NewLayer[rules, $Metal2, "CC2", "Metal 2", "Defines second metal interconnects", CMosB.met2];
pad: Layer ← NewLayer[rules, $Pad, "CG", "Pad Window 1", "Defines openings on the passivation layer for probing and bonding", CMosB.ovg];
Generalized Layout Rules
Diffusion Rules
Min Width
NewRule[rules, $NDifWidth, width, nDif, NIL, 2, "n dif width"];
NewRule[rules, $PDifWidth, width, pDif, NIL, 2, "p dif width"];
Min space between N+ to N+, P+ to P+, or P+ to N+ when the two adjacent diffusions are located on the same substrate and one or both are intended to be isolated from the substrate (such as a drain diffusion).
NewRule[rules, $NDifSpace, intraspace, nDif, NIL, 35, "n dif space", 10];
NewRule[rules, $PDifSpace, intraspace, pDif, NIL, 35, "p dif space", 10];
Polysilicon Rules
Min width
NewRule[rules, $PolyWidth, width, poly, NIL, 2, "poly width"];
Min poly spacing
NewRule[rules, $PolySpace, intraspace, poly, NIL, 25, "poly space", 10];
Min poly spacing to unrelated diffusion
$PolyNDifSpace used by ECAD
Checking this rule by rectangle pairs requires that the errors between the gate poly and the channel diffusion be suppressed when a transistor is exploded.
NewRule[rules, $PolyNDifSpace, interspace, poly, nDif, 1, "poly ndif space"];
NewRule[rules, $PolyPDifSpace, interspace, poly, pDif, 1, "poly pdif space"];
Contact Rules
Contact to P+ And N+ Diffusion And Poly:
Min contact size
NewRule[rules, $ContactWidth, width, contact, NIL, 2, "contact width"];
Max contact size
Must know that the contact rectangle is not part of a butting contact.
NewRule[rules, $ContactMaxWidth, maxWidth, contact, NIL, 5, "contact max width"];
Min contact to contact spacing
NewRule[rules, $ContactSpace, intraspace, contact, NIL, 3, "contact space"];
Min poly overlap of contact
Must know that contact rectangle belongs to poly contact.
NewRule[rules, $PolyContactSurround, surround, poly, contact, 1, "poly contact surround"];
Min diffusion overlap of contact
Must know what sort of diffusion contact the contact rectangle belongs to.
NewRule[rules, $PDifContactSurround, surround, pDif, contact, 1, "p dif contact surround"];
NewRule[rules, $NDifContactSurround, surround, nDif, contact, 1, "n dif contact surround"];
Min metal 1 overlap of contact to poly and diffusion
NewRule[rules, $Metal1ContactSurround, surround, metal1, contact, 1, "metal 1 contact surround"];
Metal 1 Rules
Min width
NewRule[rules, $Metal1Width, width, metal1, NIL, 25, "metal 1 width"];
Min space
NewRule[rules, $Metal1Space, intraspace, metal1, NIL, 25, "metal 1 space"];
Max current carrying capability 0.5 mA/m
Via Rules
Min size
NewRule[rules, $ViaWidth, width, via, NIL, 2, "via width"];
Max size
Except at the pads.
NewRule[rules, $ViaMaxWidth, maxWidth, via, NIL, 5, "via max width"];
Min via to via space
NewRule[rules, $ViaSpace, intraspace, via, NIL, 4, "vias pace"];
Min metal 1 and 2 overlap of via
NewRule[rules, $Metal1ViaSurround, surround, metal1, via, 1, "metal 1 via surround"];
NewRule[rules, $Metal2ViaSurround, surround, metal2, via, 1, "metal 2 via surround"];
Min via to poly spacing
We might want to change this so that via over poly is always illegal.
NewRule[rules, $PolyViaSpace, interspace, poly, via, 2, "poly via space"];
Min poly overlap of via (when via is inside of the poly)
NewRule[rules, $PolyViaSurround, surround, poly, via, 3, "poly via surround"];
Min via to contact of diffusion spacing
NewRule[rules, $DifCutViaSpace, special, via, contact, 2, "dif cut via space"];
Min via to contact to poly spacing
This rule and 6.7.8 together define the spacing between via and contact. If this rule becomes smaller than 6.7.8 then 6.7.8 becomes interspace and this rule becomes special.
NewRule[rules, $PolyCutViaSpace, interspace, via, contact, 3, "poly cut via space"];
Max current carrying capability is 0.07 mA per micron of via hole periphery
Metal 2 Rules
Min width
NewRule[rules, $Metal2Width, width, metal2, NIL, 25, "metal 2 width"];
Min space
NewRule[rules, $Metal2Space, intraspace, metal2, NIL, 25, "metal 2 space"];
Max current carrying capability 1.0 mA/m
Additional Layout Requirements (not shrinkable)
Most of the dimensions specified here are in microns. When they are drawn on the layout grid the number of Lambda must be chosen in such a way that the final dimensions in microns are not smaller than the ones indicated (i.e. bond pad dimensions in microns are not shrinkable).
Bonding pads consist of a metal 1 pad, a via opening over metal 1, a metal 2 pad and opening into the passivation layers.
Minimum pad dimension for metal 1 & 2
NewMicronRule[rules, $PadMetalWidth, special, NIL, NIL, 25, "pad metal width"];
Min metal 1 & 2 overlap of via
NewMicronRule[rules, $PadMetalViaSurround, special, NIL, NIL, 5, "pad metal via surround", 10];
Min metal 2 overlap of pad mask (layer 70) opening
NewMicronRule[rules, $Metal2PadSurround, surround, metal2, pad, 5, "metal 2 pad surround"];
Min spacing between metal edges of adjacent pads
This is set to 51 instead of 50.8 so that the scaling is integer.
NewMicronRule[rules, $PadMetalSpace, special, NIL, NIL, 25, "pad metal space"];
Hole Types
{
metal1Surround: RuleValue ← FindRuleValue[rules, $Metal1ContactSurround];
NewHoleType[rules, $PolyContact, metal1, poly, contact, metal1Surround, FindRuleValue[rules, $PolyContactSurround]];
NewHoleType[rules, $NDifContact, metal1, nDif, contact, metal1Surround, FindRuleValue[rules, $NDifContactSurround]];
NewHoleType[rules, $PDifContact, metal1, pDif, contact, metal1Surround, FindRuleValue[rules, $PDifContactSurround]];
};
NewHoleType[rules, $Via, metal1, metal2, via, FindRuleValue[rules, $Met1ViaSurround], FindRuleValue[rules, $Met2ViaSurround]];
Registration
DesignRules.RegisterRuleSet[rules];
};