Silicon-on-Silicon Hybrid Integrated Circuits Introduction motivation overview of advantages, technology why is this topic important pictures of circuits? The Silicon-on-Silicon Technology silicon based, metal interconnection fabrication issues existing technology problems limits of technology Building Systems with This Technology amount of interconnection, number of pins implications: speed, packing density, architecture Alternatives/Comparisons competition for system level packaging wafer scale integration printed circuits fine line printed circuits ceramic hybrids comparison fundamental issues what has been published what is available commercially Summary ΚŽ˜J˜IcenteršΟb-˜-J˜head2˜ J˜ J˜"J˜J˜—˜!J˜$J˜J˜J˜J˜—šΟt%˜%J˜)J˜2—˜˜&J˜J˜J˜J˜—šž ˜ J˜J˜J˜——L˜—…—ž2